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NXP Opens Doors with HID Global Collaboration

Embedding HID Global Seos technology in NXP SmartMX Secure Elements enables a turnkey physical access solution.

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By: DAVID SAVASTANO

Contributing Editor, Coatings World and Ink World, Coatings World and Ink World Magazine

NXP Semiconductors N.V. announced a strategic collaboration with HID Global. The HID Global Seos credential technology will be embedded in NXP’s SmartMX-based secure element devices.
 
Through the collaboration, NXP and HID Global aim to enable the use of wearable devices to open electronic locks at commercial buildings, hotels and workplaces in the future. Additionally, NXP and HID Global are cooperating on a broad range of opportunities to expand the adoption of secure access to more applications and use cases.
 
Wearables manufacturers worldwide with the Seos-ready NXP chips can enable users with building and parking access, PC login, authentication to IT systems and cloud applications, secure print job collection, time and attendance, point of sale and automated cashless vending, along with numerous other use cases supported by Seos.
 
“As the lines between personal and business use of devices continues to blur, the agreement with NXP marks an important step in HID Global’s commitment to extend options that allow manufacturers and end users to carry trusted identities on more smart devices for existing and emerging use cases,” said Stefan Widing, president and CEO of HID Global.
 
“Consumers should expect more from their smart phones and wearables,” said Sami Nassar, VP of cyber security solutions at NXP Semiconductors. “Through this partnership and with the addition of Seos access onto NXP security elements, we created a powerful turnkey solution enabling wearables to provide access to enterprise, buildings and homes with a simple ‘tap.’ NXP customers and partners will have even more options in logical and physical access when embedding a secure element in wearable devices.”

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